June 2017

Conference Paper

Genetic Algorithm Design of a 3D Printed Heat Sink

By:
Wu, Tong ; Ozpineci, Burak ; Ayers, Curtis W
Page Number:
3529-3536
Volume:
N/A
Publication Date:
June 5, 2017
Conference Name:
Applied Power Electronics Conference (APEC) 2016
Conference Location:
Long Beach, California, United States of America
Conference Sponsor:
Currently trying to get funding from APEC and University of TN to attend meeting.

Abstract

In this paper, a genetic algorithm- (GA-) based approach is discussed for designing heat sinks based on total heat generation and dissipation for a pre-specified size andshape. This approach combines random iteration processesand genetic algorithms with finite element analysis (FEA) to design the optimized heat sink. With an approach that prefers“survival of the fittest”, a more powerful heat sink can bedesigned which can cool power electronics more efficiently. Some of the resulting designs can only be 3D printed due totheir complexity. In addition to describing the methodology, this paper also includes comparisons of different cases to evaluate the performance of the newly designed heat sinkcompared to commercially available heat sinks.


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