July 2011

Conference Paper

250 degrees C SiC High Density Power Module Development

By:
Ning, Puqi ; Wang, Fei ; Ngo, Khai
Page Number:
1275-1281
Publication Date:
July 11, 2011
Conference Name:
The Applied Power Electronics Conference and Exposition (APEC 2011)
Conference Location:
Fort worth, Texas, United States of America
Conference Sponsor:
IEEE, PSMA, PELS, and IAS