Studio portrait of Whit Vinson, R&D Associate in Power Electronics Packaging at Oak Ridge National Laboratory, wearing a black suit, white shirt, and light green tie while smiling at the camera against a gray textured backdrop at the National Transportation Research Center.

Whit M. Vinson

R&D Associate, Power Electronics Packaging

Whit Vinson studied mechanical engineering at the University of Arkansas in Fayetteville, where he gained experimental and computational experience working on packaging, reliability evaluation, multi-physical interactions, and thermal management for micro- and power electronics. Whit joined the Vehicle Power Electronics Research Group at ORNL in August of 2025 as a UT-ORII Fellow.

At ORNL, Whit executes experimental and computational studies to develop extreme environment power electronics packaging strategies. He is interested in vehicles with electrified powertrains used in terrestrial, aquatic, aerial, and extraterrestrial application spaces as well as power generation and transmission systems.