November 2023

Conference Paper

End-to-end I/O portfolio for the summit supercomputing ecosystem

By:
Oral, Hakki S; Vazhkudai, Sudharshan S; Wang, Feiyi ; Zimmer, Christopher J; Brumgard, Christopher D; Hanley, Jesse A; Markomanolis, Georgios ; Miller, Ross G; Leverman, Dustin B; Atchley, Edward S; Melesse Vergara, Veronica G
Page Number:
63
Book Title:
Proceedings of the International Conference for High Performance Computing, Networking, Storage, and Analysis (SC19)
Publication Date:
November 2023
Publisher Location:
ACM, United States of America
Conference Name:
The International Conference for High Performance Computing, Networking, Storage, and Analysis (SC19)
Conference Location:
Denver, Colorado, United States of America
Conference Sponsor:
ACM
View DOI Listing:
https://doi.org/10.1145/3295500.3356157

Abstract

The I/O subsystem for the Summit supercomputer, No. 1 on the Top500 list, and its ecosystem of analysis platforms is composed of two distinct layers, namely the in-system layer and the center-wide parallel file system layer (PFS), Spider 3. The in-system layer uses node-local SSDs and provides 26.7 TB/s for reads, 9.7 TB/s for writes, and 4.6 billion IOPS to Summit. The Spider 3 PFS layer uses IBM's Spectrum Scale™ and provides 2.5 TB/s and 2.6 million IOPS to Summit and other systems. While deploying them as two distinct layers was operationally efficient, it also presented usability challenges in terms of multiple mount points and lack of transparency in data movement. To address these challenges, we have developed novel end-to-end I/O solutions for the concerted use of the two storage layers. We present the I/O subsystem architecture, the end-to-end I/O solution space, their design considerations and our deployment experience.

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