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Resin chemistry and particle size influence on stereolithography with silicon carbide...

by Tien P Herd, Corson L Cramer, Steven R. Schmid
Publication Type
Conference Paper
Journal Name
Manufacturing Letters
Publication Date
Page Numbers
1107 to 1112
Volume
44
Issue
Supplement
Conference Name
53rd SME North American Manufacturing Research Conference (NAMRC 53)
Conference Location
Greenville, South Carolina, United States of America
Conference Sponsor
SME
Conference Date
-
Stereolithography (SLA) is an established process able to produce high resolution polymer parts with complex geometries. Silicon carbide (SiC) has uses in a variety of applications, but traditionally was difficult to manufacture into complex geometries. There have been advances in producing SiC through SLA using a SiC-derived ceramic such as silicon oxycarbide (SiOC). In this study, a slurry using a commercially available resin as the base material with additional modifiers was investigated to create a SiC slurry ready for pressureless sintering. The effects of photoinitiator, dispersant and a bimodal distribution of SiC particle sizes was studied using a design of experiments (DOE). A slurry with a bimodal distribution of 70 % coarse and 30 % fine SiC powder at 40 % solids loading by volume was prepared and successfully printed. Rheology measurements show the slurry to have viscoelastic shear thinning behavior below the recommended 1000 Pas necessary for printing. Printing parameters for the new material on a commercially available SLA printer were studied parametrically. The laser marking speeds found to print the slurry was 260 mm/s and 130 mm/s. A slurry and printing parameters were determined to produce a green part with a proposed debinding cycle.