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Curriculum Vita

Thomas P. Karnowski
 

P.O. Box 2008, Oak Ridge National Laboratory, Oak Ridge, TN 37831-6075
Wk: (865) 574-5732, Fax: (865) 576-8993
E-mail: karnowskitp@ornl.gov
 

Experience
 
  Thomas Karnowski

Mr. Thomas P. Karnowski is an Research &Development Staff Member in the Image Science and Machine Vision Group (ISMV)at Oak Ridge National Laboratory (ORNL). He began working at ORNL in 1990 in the Real Time Systems Group and joined the ISMV Group in 1995. He received his B.S. in Electrical Engineering from the University of Tennessee-Knoxville in 1988 and his M.S. in Electrical Engineering from North Carolina State University in 1990. His current research interests are signal processing, optical signal processing, content-based image retrieval, data compression, and image segmentation of biological cellular data. He is a co-inventor of two patents and author or co-author on 29 papers in the field of optical and image processing and pattern recognition. He received a National Federal Laboratory Consortium Award for Excellence in Technology Transfer in 1998 and 2002 and an R&D 100 award in 2002. He is a member of the IEEE.

Education
M.S.

Electrical Engineering, North Carolina State, Raleigh, North Carolina, 1990

B.S. Electrical Engineering, University of Tennessee, Knoxville, Tennessee, 1988
Issued and Pending Patents
 

Tobin, K. W., Karnowski, T. P., and Ferrell, R. K., “Method for Indexing and Retrieving Manufacturing-Specific Digital Imagery Based on Image Content,” ERID No. 0668/Q&B 6321-131, September 1999. U.S. Patent No. ???, 2004.

Karnowski, T. P. and Price J. R., “Robust Telomere Segmentation by Integrated Statistical Training,” ORNL Invention Disclosure 1384, submitted March 2004.

Tobin, K. W., Karnowski, T. P., and Ferrell, R. K., “Method for Localizing and Isolating an Errant Process Step,” U.S. Patent No. 6,535,776, March 18, 2003.

Hanson, G. R., Bingham, P. R., Simpson, R. T., Voelkle, E., and Karnowski, T. P., “Technique for Optaining Two-Wavelength Differential-Phase Direct-to-Digital Heterodyned Holograms,” ORNL ID No. 0933, April, 2003.

Karnowski, T. P., Bingham, P. R., Tobin, K. W., and Simpson, J. T., “Through-the-Pellicle Heterodyne Mask Inspection,” UT-Battelle, LLC, Invention Disclosure No. 1311, August 13, 2003.

Karnowski, T. P. and Tobin, K. W., “Content-Based Pattern Retrieva,” UT-Battelle, LLC, Invention Disclosure No. 1227C, S-101,813, January 2003.

Tobin, K. W. and Karnowski, T. P., “A Method for Directed Indexing of Image Databases for Content-Based Retrieval Applications,” UT-Battelle, LLC, Invention Disclosure No. 1151, September 2002.

Tobin, Jr., K. W., Gleason, S. S., and Karnowski, T. P., and Sari-Sarraf, H., “Automated Defect Signature Analysis for Semiconductor Manufacturing Process Improvement,” U.S. Patent No. 5,982,920, January 7, 1997.

Recent Awards
 

National Federal Laboratory Consortium Award for Excellence in Technology Transfer in 1998 and 2002 and an R&D 100 award in 2002.
 

Selected Publications
 

Karnowski, T. P., Allard, L., Joy, D., and Clonts, L., “System Considerations for Maskless Lithography,” Proceedings of the SPIE: Emerging Lithographic Techniques VIII, Santa Clara, California, February 2004.

Price, J. R., Bingham, P. R., Tobin, K. W., and Karnowski, T. P., “Semiconductor Sidewall Shape Estimation Using Top-Down CD-SEM Image Retrieval,” IEEE/SME/SPIE 6th International Conference on Quality Control by Artificial Vision, Proceedings of the SPIE, Vol. 5132, May 2003.

Price, J. R., Bingham, P.R., Tobin, K. W., and Karnowski, T. P., “Estimating Cross-section Semiconductor Structure by Comparing Top-down SEM Images”, Machine Vision Applications in Industrial Inspection XI, Proceedings of SPIE, Vol. 5011, March 2003.

Tobin, K. W., Lakhani, F., and Karnowski, T. P., “An Industry Survey of Automatic Defect Classification Technologies, Methods, and Performance,” Design, Process Integration, and Diagnostics in IC Manufacturing, Proceedings of SPIE, Vol. 4692, March 2002.

Tobin, K. W., Karnowski, T. P., Arrowood, L. F., Ferrell, R. K., Goddard, J. S., Lakhani, F., “Content-Based Image Retrieval for Semiconductor Process Characterization,” EURASIP Journal on Applied Signal Processing, Special Issue on Applied Visual Inspection 2002(7), 2002.

Karnowski, T. P., Tobin, K. W., Ferrell, R. K., and Lakhani, F., “Using an Image Retrieval System for Image Data Management,” Design, Process Integration, and Diagnostics in IC Manufacturing, Proceedings of SPIE, Vol. 4692, March 2002.

Gleason, S. S., Ferrell, R. K., Karnowski, T. P., and Tobin, K. W., “Detection of Semiconductor Defects Using a Novel Fractal Encoding Algorithm,” Design, Process Integration, and Diagnostics in IC Manufacturing, Proceedings of SPIE, Vol. 4692, March 2002.

Tobin, K. W., Karnowski, T.P., Arrowood, L.F., Ferrell, R.K., Goddard, J.S., Lakhani, F., "Content-based Image Retrieval for Semiconductor Process Characterization", EURISP Journal on Applied Signal Processing, Special Issue on Applied Visual Inspection, Vol. 2002, No. 7, July 2002.

Tobin, K. W. and Karnowski, T. P., “Revolutionizing Defect Image Management,” SPIE's OE Magazine 1(7), July 2001.

Tobin, K. W., Karnowski, T. P., Arrowood, L. F., and Lakhani, F., “Field Test Results of an Automated Image Retrieval System,” 12th Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop, Munich, Germany, April 23-24, 2001 .

Tobin, K. W., Karnowski, T. P., and Lakhani, F., “Integrated Applications of Inspection Data in the Semiconductor Manufacturing Environment,” Metrology-Based Control for Micro-Manufacturing, Proceedings of SPIE, Vol. 4275, 2001, pp. 31-40.

Karnowski, T. P., Tobin, K. W., Arrowood, L. F., Goddard, J. S., Ferrell, R. K., and Lakhani, F., “Field Test Results of an Image Retrieval System for Semiconductor Yield Learning,” Metrology-based Control for Micro-Manufacturing, Proceedings of SPIE, Vol. 4275, 2001, pp. 41-52.

Karnowski, T. P., Gleason, S. S., and Tobin, K. W., “Fuzzy Logic Connectivity in Semiconductor Defect Clustering,” SME Technical Paper MS00-240, Society of Manufacturing Engineers, Dearborn, Michigan, 2000.

Tobin, K. W., Karnowski, T. P., and Lakhani, F., “Technology Considerations for Future Semiconductor Data Management Systems,” Semiconductor Fabtech, Vol. 12, ICG Publishing, Ltd., London, England, Spring 2000.

Tobin, K. W., Karnowski, T. P., and Lakhani, F. “Managing Defect Image Databases for Semiconductor Yield Monitoring and Control,” Global Semiconductor, Sterling Publications, London, England, February 2000.

Tobin, K. W., Karnowski, T. P., and Lakhani, F., “The Use of Historical Defect Imagery for Yield Learning,” The 11th Annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop, Fairmont Copley Plaza Hotel, Boston, Massachusetts, September 12-14, 2000.

Tobin, K. W., Karnowski, T. P., and Lakhani, F., “A Survey of Semiconductor Data Management Systems Technology,” Metrology, Inspection, and Process Control for Microlithogrpahy, Proceedings SPIE, Vol. 3998, pp. 248-257, June 2000.

Karnowski, T. P., Tobin, K. W., Ferrell, R. K., and Lakhani, F., “Content Based Image Retrieval for Semiconductor Manufacturing,” Machine Vision Applications in Industrial Inspection, Proceedings of SPIE, Vol. 3966, 2000, pp. 162-172, March 2000.

Gee, T. F., Karnowski, T. P., and Tobin, K. W., “Multiframe Combination and Blur Deconvolution of Video Data,” IS&T/SPIE's 12th International Symposium on Electronic Imaging: Science and Technology, San Jose Convention Center, January 2000.

Karnowski, T. P., Tobin, K. W., Jensen, D., and Lakhani, F., “The Application of Spatial Signature Analysis to Electrical Test Data: Validation Study,” Metrology, Inspection, and Process Control for Microlithography XIII, Proceedings of SPIE, Vol. 3677, 1999, pp. 530-541.

Tobin, K. W., Karnowski, T. P., and Ferrell, R. K., “Image Retrieval in the Industrial Environment,” Machine Vision Applications in Industrial Inspection VII, Proceedings of SPIE, Vol. 3652, January 1999, p. 184-192.

Hunt, M. A., Karnowski, T. P., Tobin, K. W., and Simpson, M. L., “Tristimulus Color Measurement of Printed Textile Patterns Using the POCS Algorithm,” IS&T/SPIE's 11th International Symposium on Electronic Imaging: Science and Technology, San Jose Convention Center, January 1999.

Tobin, K. W., Karnowski, T. P., Gleason, S. S., Jensen, D., and Lakhani, F., “Using Historical Wafermap Data for Automated Yield Analysis,” Journal of Vacuum Science Technology, Summer 1999.

Tobin, K., Karnowski, T., Gleason, S., Jensen, D., and F. Lakhani, “Integrated Yield Management,” 196th Meeting of the Electrochemical Society, Inc., October 17-22, Honolulu, Hawaii, 1999.

Tobin, K. W., Gleason, S. S., Karnowski, T. P., and Bennett, M. H., “Semiconductor Defect Data Reduction for Process Automation and Characterization,” Journal of Process and Analytical Chemistry 3(3,4), Spring 1998.

Tobin, K. W., Gleason, S. S., Karnowski, T. P., and Guidry, D., “Using SSA to Measure the Efficacy of Automated Defect Data Gathering,” Micro, Canon Communications, LLC, Los Angeles, California, April 1998.

Gleason, S. S., Tobin, K. W., and Karnowski, T. P., “Rapid Yield Learning Through Optical Defect and Electrical Test Analysis,” SPIE's Metrology, Inspection, and Process Control for Microlithography XII, Santa Clara Convention Center, February 1998.

Tobin, K. W., Gleason, S. S., and Karnowski, T. P., “Adaptation of the Fuzzy K-Nearest Neighbor Classifier for Manufacturing Automation,” Machine Vision Applications in Industrial Inspection, Proceedings of SPIE, Vol. 3306, 1998, pp. 122-130.

Karnowski, T. P., Gleason, S. S., and Tobin, K. W., “Fuzzy Connectivity of Semiconductor Defect Events,” SPIE's 10th International Symposium on Electronic Imaging: Science and Technology, San Jose Convention Center, January 1998.

Gleason, S. S., Tobin, K. W., and Karnowski, T. P., “An Integrated Spatial Signature Analysis and Automatic Defect Classification System,” 191st Meeting of the Electrochemical Society, Inc., May 1997.

Tobin, K. W., Gleason, S. S., Karnowski, T. P., Cohen, S. L., and Lakhani, F., “Automatic Classification of Spatial Signatures on Semiconductor Wafermaps,” Metrology, Inspection, and Process Control for Microlithography XI, Proceedings of SPIE, Vol. 3050, p. 434-444, July, 1997.

Tobin, K. W., Gleason, S. S., Karnowski, T. P., Cohen, S. L., “Feature Analysis and Classification of Manufacturing Signatures on Semiconductor Wafers,” Machine Vision Applications in Industrial Inspection V, Proceedings of SPIE, Vol. 3029, p. 12-25, April 1997.

Tobin, K. W., Gleason, S. S., Karnowski, T. P., Bennett, M. H., “An Image Paradigm for Semiconductor Defect Data Reduction”, Metrology, Inspection, and Process Control for Microlithography X, Proceedings of SPIE, Vol. 2725, p. 194-205, May 1996.

Gleason, S. S., Tobin, K. W., and Karnowski, T. P., “Spatial Signature Analysis of Semiconductor Defects for Manufacturing Problem Diagnosis,” Solid State Technology, PennWell Corp., Tulsa, Oklahoma, July 1996.

Breeding, J. E. and Karnowski, T. P., “A Method for Efficient Fractional Sample Delay Generation for Real-Ttime Frequency-Domain Beamformers,” presented at The International Conference on Signal Processing Applications and Technology, Boston, Massachusetts, 1995.

Karnowski, T. P. and VanderLugt, A., “Generalized Filtering in Acoustooptic Systems Using Area modulation,” Applied Optics 30, 1991.

   

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